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  5/15/12 IRFH7110PBF hexfet   power mosfet notes   through  are on page 9  features and benefits www.irf.com 1 pqfn 5x6 mm applications ??? secondary side synchronous rectification ?? inverters for dc motors ?? ? dc-dc brick applications ?? ? boost converters features benefits low rdson (< 13.5mw) lower conduction losses low thermal resistance to pcb (< 1.2c/w) enables better thermal dissipation low profile (<0.9 mm) results in increased power density industry-standard pinout ? note form quantity irfh7110trpbf pqfn 5mm x 6mm tape and reel 4000 irfh7110tr2pbf pqfn 5mm x 6mm tape and reel 400 orderable part number package type standard pack v ds 100 v v gs max 20 v r ds(on) max (@v gs = 10v) 13.5 m ? q g (typical) 58 nc r g (typical) 0.6 ? i d (@t c(bottom) = 25c) 50 a absolute maximum ratings parameter units v ds drain-to-source voltage v gs gate-to-source voltage i d @ t a = 25c continuous drain current, v gs @ 10v i d @ t a = 70c continuous drain current, v gs @ 10v i d @ t c(bottom) = 25c continuous drain current, v gs @ 10v i d @ t c(bottom) = 100c continuous drain current, v gs @ 10v i d @ t c = 25c continuous drain current, v gs @ 10v (package limited) i dm pulsed drain current p d @t a = 25c power dissipation  p d @t c(bottom) = 25c power dissipation  linear derating factor  w/c t j operating junction and t stg storage temperature range -55 to + 150 3.6 0.029 104 max. 11 37  240 20 100 8.6 58  50  v w a c

 2 www.irf.com s d g static @ t j = 25c (unless otherwise specified) parameter min. typ. max. units bv dss drain-to-source breakdown voltage 100 ??? ??? v ?? v dss / ? t j breakdown voltage temp. coefficient ??? 0.09 ??? v/c r ds(on) static drain-to-source on-resistance ??? 10.6 13.5 m ? ? ? avalanche characteristics parameter units e as single pulse avalanche energy mj i ar avalanche current  a diode characteristics parameter min. typ. max. units i s continuous source current (body diode) i sm pulsed source current (body diode)  v sd diode forward voltage ??? ??? 1.3 v t rr reverse recovery time ??? 27 41 ns q rr reverse recovery charge ??? 140 210 nc t on forward turn-on time time is dominated by parasitic inductance mosfet symbol na ns a pf nc v ds = 50v ??? v gs = 20v v gs = -20v ??? ??? 240 ??? ??? 50  conditions v gs = 0v, i d = 250 a reference to 25c, i d = 1.0ma v gs = 10v, i d = 35a  conditions max. 110 35 ? = 1.0mhz t j = 25c, i f = 35a, v dd = 50v di/dt = 500a/ s  t j = 25c, i s = 35a, v gs = 0v  showing the integral reverse p-n junction diode. typ. ??? r g =1.8 ? v ds = 25v, i d = 35a i d = 35a i d = 35a v gs = 0v v ds = 25v v ds = 16v, v gs = 0v v dd = 50v, v gs = 10v v ds = v gs , i d = 100 a a v gs = 10v v ds = 100v, v gs = 0v, t j = 125c v ds = 100v, v gs = 0v thermal resistance parameter typ. max. units r ? ??? 1.2 r ? ??? 32 c/w r ?  ??? 35 r ?  ??? 22

 www.irf.com 3 fig 4. normalized on-resistance vs. temperature fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics fig 6. typical gate charge vs. gate-to-source voltage fig 5. typical capacitance vs. drain-to-source voltage -60 -40 -20 0 20 40 60 80 100 120 140 160 t j , junction temperature (c) 0.5 1.0 1.5 2.0 2.5 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( n o r m a l i z e d ) i d = 35a v gs = 10v 1 10 100 v ds , drain-to-source voltage (v) 10 100 1000 10000 100000 c , c a p a c i t a n c e ( p f ) coss crss ciss v gs = 0v, f = 1 mhz c iss = c gs + c gd , c ds shorted c rss = c gd c oss = c ds + c gd 0.1 1 10 100 v ds , drain-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) ? 60 s pulse width tj = 25c 4.0v vgs top 10v 6.0v 5.5v 5.0v 4.8v 4.5v 4.3v bottom 4.0v 0.1 1 10 100 v ds , drain-to-source voltage (v) 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) ? 60 s pulse width tj = 150c 4.0v vgs top 10v 6.0v 5.5v 5.0v 4.8v 4.5v 4.3v bottom 4.0v 2.0 3.0 4.0 5.0 6.0 7.0 v gs , gate-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) v ds = 50v ? 60 s pulse width t j = 25c t j = 150c 0 20406080 q g total gate charge (nc) 0 4 8 12 16 v g s , g a t e - t o - s o u r c e v o l t a g e ( v ) v ds = 80v v ds = 50v v ds = 20v i d = 35a

 4 www.irf.com fig 11. maximum effective transient thermal impedance, junction-to-case (bottom) fig 8. maximum safe operating area fig 9. maximum drain current vs. case (bottom) temperature fig 7. typical source-drain diode forward voltage fig 10. threshold voltage vs. temperature 0.2 0.4 0.6 0.8 1.0 1.2 v sd , source-to-drain voltage (v) 0.1 1 10 100 1000 i s d , r e v e r s e d r a i n c u r r e n t ( a ) t j = 25c t j = 150c v gs = 0v 25 50 75 100 125 150 t c , case temperature (c) 0 10 20 30 40 50 60 i d , d r a i n c u r r e n t ( a ) limited by package -75 -50 -25 0 25 50 75 100 125 150 t j , temperature ( c ) 1.5 2.0 2.5 3.0 3.5 4.0 4.5 v g s ( t h ) g a t e t h r e s h o l d v o l t a g e ( v ) i d = 100 a i d = 250 a i d = 1.0ma i d = 1.0a 1e-006 1e-005 0.0001 0.001 0.01 0.1 t 1 , rectangular pulse duration (sec) 0.001 0.01 0.1 1 10 t h e r m a l r e s p o n s e ( z t h j c ) c / w 0.20 0.10 d = 0.50 0.02 0.01 0.05 single pulse ( thermal response ) notes: 1. duty factor d = t1/t2 2. peak tj = p dm x zthjc + tc 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) tc = 25c tj = 150c single pulse 1msec 10msec operation in this area limited by r ds (on) 100 sec dc l imited by package

 www.irf.com 5 fig 13. maximum avalanche energy vs. drain current fig 12. on-resistance vs. gate voltage fig 14b. unclamped inductive waveforms fig 14a. unclamped inductive test circuit t p v (br)dss i as r g i as 0.01 ? t p d.u.t l v ds + - v dd driver a 15v 20v fig 15a. switching time test circuit fig 15b. switching time waveforms v gs v ds 90% 10% t d(on) t d(off) t r t f   
 ????      ?????          + -     4 8 12 16 20 v gs , gate-to-source voltage (v) 0 10 20 30 40 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( m ? ) t j = 25c t j = 125c i d = 35a 25 50 75 100 125 150 starting t j , junction temperature (c) 0 100 200 300 400 500 e a s , s i n g l e p u l s e a v a l a n c h e e n e r g y ( m j ) i d top 4.7a 9.6a bottom 35a

 6 www.irf.com fig 16. 
         for n-channel hexfet   power mosfets fig 17. gate charge test circuit fig 18. gate charge waveform vds vgs id vgs(th) qgs1 qgs2 qgd qgodr       ?????       ????   ????         p.w. period di/dt diode recovery dv/dt ripple ? 5% body diode forward drop re-applied voltage reverse recovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period 
 





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 www.irf.com 7 pqfn 5x6 outline "e" package details 
            
           http://www.irf.com/technical-info/appnotes/an-1154.pdf note: for the most current drawing please refer to ir website at: http://www.irf.com/package/ pqfn 5x6 outline "e" part marking xxxx xywwx xxxxx international rectifier logo part number (?4 or 5 digits?) marking code (per marking spec) assembly site code (per scop 200-002) date code pin 1 identifier lot code (eng mode - min last 4 digits of eati#) (prod mode - 4 digits of spn code)

 8 www.irf.com pqfn 5x6 outline "e" tape and reel    reel dimensions note: controlling dimensions in mm std reel quantity is 4000 parts. standard option (qty 4000) min 329.5 20.9 12.8 1.7 97 ref 13 code a b c d e f g max 330.5 21.5 13.5 2.3 99 17.4 14.5 min 12.972 0.823 0.504 0.067 3.819 0.512 max 13.011 0.846 0.532 0.091 3.898 0.571 metric imperial tr1 option (qty 400) imperial min 6.988 0.823 0.520 0.075 2.350 0.512 max 178.5 21.5 13.8 2.3 66 12 14.5 min 177.5 20.9 13.2 1.9 65 ref 13 metric max 7.028 0.846 0.543 0.091 2.598 0.571

 www.irf.com 9  qualification standards can be found at international rectifier?s web site http://www.irf.com/product-info/reliability   higher qualification ratings may be available should the user have such requirements. please contact your international rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/   applicable version of jedec standard at the time of product release. ir world headquarters: 233 kansas st., el segundo, california 90245, usa tel: (310) 252-7105 tac fax: (310) 252-7903 visit us at www.irf.com for sales contact information . 5/2012 data and specifications subject to change without notice.   
repetitive rating; pulse width limited by max. junction temperature. 
starting t j = 25c, l = 0.174mh, r g = 50 ? , i as = 35a.  pulse width ? 400 s; duty cycle ? 2%.  r ? is measured at t j of approximately 90c.  when mounted on 1 inch square 2 oz copper pad on 1.5x1.5 in. board of fr-4 material. 
calculated continuous current based on maximum allowable junction temperature.  package is limited to 50a by die-source to lead-frame bonding technology ms l 1 (per je de c j-s t d-020d ??? ) rohs compliant yes pqfn 5mm x 6mm qualification information ? moisture sensitivity level qualification level industrial ?? (per je de c je s d47f ??? guidelines )


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